The US Commerce Department said on Thursday it plans to grant $75 million to Absolics for constructing a 120,000-square-foot facility in Georgia that will...
WASHINGTON - The US Commerce Department said on Thursday it plans to grant $75 million to Absolics for constructing a 120,000-square-foot facility in Georgia that will supply advanced materials to the country's semiconductor industry.
Absolics’ glass substrate allows for processing and memory chips to be packed into a single device allowing for faster, more efficient computing. The Commerce Department said glass substrates from Absolics will be used to boost performance of leading-edge chips for AI and data centers. The same month, Amkor Technology said it would spend $2 billion to build a new advanced packaging and test facility in Arizona that will package and test chips for Apple produced at a nearby Taiwanese chipmaker TSMC facility.
"I wouldn’t have wanted to be away from home five days a week. That wouldn’t have been good for the family or for me.”SAN FRANCISCO — Nvidia on Wednesday overshot Wall Street estimates as its profit skyrocketed, bolstered by the chipmaking dominance that has made the company an icon of the artificial intelligence boom.
Advanced Materials Advanced Packaging Advanced Material Semiconductor Packaging Glass Substrate Semiconductor Industry Packaging
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