Taiwanese chipmaker TSMC has developed the most expansive arsenal of patents surrounding advanced chip packaging, followed by Samsung Electronics and then Intel , according to data from LexisNexis.
Advanced chip packaging is a crucial technology that squeezes the most horsepower from the latest chip designs, and is crucial to chip contract manufacturers vying for business.
The data from LexisNexis, released last month, indicates that TSMC and Samsung have steadily invested in advanced packaging technology for years, as Intel did not keep pace with its own filings. has a cache of 2,946 advanced packaging patents and also has the highest quality, a measure that includes how many times they are cited by other companies, according to data and analytics company LexisNexis.
Samsung Electronics, which ranks second in terms of quantity and quality of the patents, has 2,404, according to the LexisNexis data.“They seem to be the ones that pulled the field forward, and set the technology standard,” said LexisNexis PatentSight Managing Director Marco Richter in an interview, referring to TSMC, Samsung and Intel.
Intel, Samsung and TSMC have been steadily investing in advanced packaging technology since around 2015, when all three began to add to their patent portfolios, according to the data. The three businesses are the only companies in the world that have or plan to deploy the technology to fabricate the most complex, advanced chips.
Advanced packaging is crucial for improving semiconductor designs as it becomes more difficult to pack more transistors onto a single piece of silicon. Packaging technology enabled
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