Next-Gen Electronics Transformed: MIT’s 2D Integration Breakthrough

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Next-Gen Electronics Transformed: MIT’s 2D Integration Breakthrough
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Science, Space and Technology News 2024

This artist’s rendition shows a new integration platform developed by MIT researchers. By engineering surface forces, they can directly integrate 2D materials into devices in a single contact-and-release step. Credit: Courtesy of Sampson Wilcox/Research Laboratory of Electronics’s breakthrough in integrating 2D materials into devices paves the way for next-generation devices with unique optical and electronic properties.

The developed platform leverages industry-compatible toolsets, allowing for the process to be scaled. Here, lead author Peter Satterthwaite uses a modified alignment tool in MIT.nano to do a patterned, aligned integration. Credit: Courtesy of Weikun ZhuThey used this approach to fabricate arrays of 2D transistors that achieved new functionalities compared to devices produced using conventional fabrication techniques.

“Van der Waals integration has a fundamental limit,” she explains. “Since these forces depend on the intrinsic properties of the materials, they cannot be readily tuned. As a result, there are some materials that cannot be directly integrated with each other using their van der Waals interactions alone.

Van der Waals forces are natural forces of attraction that exist between all matter. For example, a gecko’s feet can stick to the wall temporarily due to van der Waals forces. Though all materials exhibit a van der Waals interaction, depending on the material, the forces are not always strong enough to hold them together.

This smoothness is important, since gaps between the surface and 2D material can hamper van der Waals interactions. Then, the researchers prepare the 2D material separately, in a completely clean environment, and bring it into direct contact with the prepared device stack.

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