Exclusive-TSMC considering advanced chip packaging capacity in Japan, sources say

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Exclusive-TSMC considering advanced chip packaging capacity in Japan, sources say
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Taiwan's TSMC is looking at building advanced packaging capacity in Japan, according to two sources familiar with the matter, a move that would add momentum ...

Taiwan Semiconductor Manufacturing Company's logo is seen while people attend the opening of the TSMC global R&D center in HsinchuTOKYO - Taiwan's TSMC is looking at building advanced packaging capacity in Japan, according to two sources familiar with the matter, a move that would add momentum to Japan's efforts to reboot its semiconductor industry.

TSMC Chief Executive C.C. Wei said in January that the company plans to double CoWos output this year with further increases slated in 2025. Japan is seen as well positioned to take a larger role in advanced packaging given that it has leading semiconductor materials and equipment makers, growing investment in chip fabrication capacity and a solid customer base.Advanced packaging would be welcomed in Japan which can offer the ecosystem to support it, a senior official at Japan's industry ministry said.

The South Korean chipmaker is also talking to companies in Japan and elsewhere about procuring materials as it prepares to introduce a packaging technology used by its rival SK Hynix to catch up in high bandwidth memory chips, Reuters has reported.In this piece, we are going to look at 15 Best Selling Car Brands in the World. If you wish to skip directly to the top 5 best selling car brands in the world, you can go to 5 Best Selling Car Brands in the World.

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